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FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Hoodman HEYENSG Compatibility ABEO 203AV

SKU 32360766713
4.1
USD125.41 USD162.41 Gallery price

Pay in 4 interest-free payments of $31.35 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 22 - Sep 27

Details & care
Description

Compatibility ABEO 203AV

Unique handle design

Long Distance: Capable of high-speed

Cable Type Balanced/stereo 1/4" male to two stereo 1/4" female Y-cable Length 6" ( 15 cm ) Shielding Not specified Connector 1 1x stereo 1/4" male Connector 2 2x stereo 1/4" female Packaging Info Package Weight 0

FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Hoodman HEYENSG Compatibility ABEO 203AVThe ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors. 1. 8mm Plate thickness Applications Industrial Product details External Diameter Metric Packages Cooled BGA, PLCC Heat Sink Material Aluminium Thermal Resistance 23C W External Length

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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